SVS has introduced the new V2400LL range of production sputtering systems for 6in wafer processing, complementing the existing V2000 range of PVD systems. The V2400LL features a load lock chamber capable of loading up to 25 wafers per batch, and allows up to four targets to be mounted in the process chamber.
The system provides a deposition uniformity of ±1% for 4in wafers and ±2.5% for 6in wafers. It offers features such as RF etch and bias capability, substrate heating or cooling, and sputtering of metals and compounds using DC, RF and DC pulse reactive sputtering, with full system automation and datalogging.
The V2400LL achieves a load lock pumpdown time to 5x10-6 Torr in less than 7 minutes. Ultimate process vacuum achievable in the process chamber is better than 1x10-7 Torr. Through-Wall access to the load ock allows the system to be installed outside the cleanroom.